View PC817X3J000F_706196.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

pc817xj0000f series 1. recognized by ul1577 (double protection isolation), file no. e64380 (as model no. pc817 ) 2. package resin : ul flammability grade (94v-0) features agency approvals/compliance 1. i/o isolation for mcus (micro controller units) 2. noise suppression in switching circuits 3. signal transmission between circuits of different po- tentials and impedances applications dip 4pin general purpose photocoupler 1. 4pin dip package 2. double transfer mold package (ideal for flow solder- ing) 3. high collector-emitter voltage (v ceo :80v) 4. current transfer ratio (ctr : min. 50% at i f =5 ma, v ce =5v) 5. several ctr ranks available 6. high isolation voltage between input and output (v iso(rms) : 5.0 kv) 7. lead-free and rohs directive compliant ? 4-channel package type is also available. (model no. pc847xj0000f series ) description pc817xj0000f series contains an ired optically coupled to a phototransistor. it is packaged in a 4pin dip, available in wide-lead spacing option and smt gullwing lead-form option. input-output isolation voltage(rms) is 5.0kv. collector-emitter voltage is 80v and ctr is 50% to 600% at input current of 5ma. 1 sheet no.: d2-a03102en date jun. 30. 2005 ?sharp corporation notice the content of data sheet is subject to change without prior notice. in the absence of confirmation by device specification sheets, sharp takes no responsibility for any defects that may occur in equipment using any sharp devices shown in catalogs, data books, etc. contact sharp in order to obtain the latest device specification sheets before usin g any sharp device. pc817xj0000f series
internal connection diagram anode cathode emitter collector 1 1 2 3 4 2 4 3 2 sheet no.: d2-a03102en outline dimensions (unit : mm) 1. through-hole [ex. pc817xj0000f ] 2. smt gullwing lead-form [ex. pc817xij000f ] 3. wide through-hole lead-form [ex. pc817xfj000f ] product mass : approx. 0.22g product mass : approx. 0.23g product mass : approx. 0.22g product mass : approx. 0.23g 4. wide smt gullwing lead-form [ex. pc817xfpj00f ] 6.5 0.5 7.62 0.3 4.58 0.5 : 0 to 13? epoxy resin 3.5 0.5 3.0 0.5 0.5 typ. 0.6 0.2 1.2 0.3 1 2 4.58 0.5 2.54 0.25 4 3 anode mark rank mark factory identification mark date code pc817 2.7 0.5 0.5 0.1 0.26 0.1 0.6 0.2 1.2 0.3 6.5 0.5 7.62 0.3 0.26 0.1 4.58 0.5 2.54 0.25 epoxy resin 3.5 0.5 4.58 0.5 2.54 0.25 4 3 anode mark rank mark factory identification mark date code 1.0 + 0.4 ? 0 1.0 + 0.4 ? 0 10.0 + 0 ? 0.5 0.35 0.25 1 2 pc817 pc817 4.58 0.5 0.6 0.2 1.2 0.3 1.0 0.1 2.54 0.25 6.5 0.5 anode mark factory identification mark date code 4 3 7.62 0.3 10.16 0.5 0.26 0.1 4.58 0.5 0.5 0.1 epoxy resin 3.5 0.5 2.7 min. rank mark 1 2 pc817 0.6 0.2 1.2 0.3 1.0 0.1 6.5 0.5 10.16 0.5 0.75 0.25 0.75 0.25 4.58 0.5 2.54 0.25 anode mark rank mark factory identification mark date code 4 3 7.62 0.3 12.0 max 4.58 0.5 epoxy resin 3.5 0.5 0.26 0.1 0.5 0.1 0.25 0.25 1 2 pc817xj0000f series
date code (2 digit) rank mark refer to the model line-up table a.d. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 mark a b c d e f h j k l m n mark p r s t u v w x a b c mark 1 2 3 4 5 6 7 8 9 o n d month january february march april may june july august september october november december a.d 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2nd digit month of production 1st digit year of production factory identification mark and plating material factory identification mark no mark country of origin japan indonesia china plating material sncu (cu : typ. 2%) snbi (bi : typ. 2%) sncu (cu : typ. 2%)* * up to date code "t4" (april 2005), snbi (bi : typ. 2%). ** this factory marking is for identification purpose only. please contact the local sharp sales representative to see the actural status of the production. 3 repeats in a 20 year cycle sheet no.: d2-a03102en pc817xj0000f series
sheet no.: d2-a03102en electro-optical characteristics parameter conditions forward voltage peak forward voltage reverse current collector dark current transfer characteristics collector current collector-emitter saturation voltage isolation resistance floating capacitance cut-off frequency min. ? ? ? ? 2.5 ? 5 10 10 ? ? ? ? typ. 1.2 ? ? ? ? 0.1 1 10 11 0.6 80 4 3 max. 1.4 3.0 10 100 30.0 0.2 ? 1.0 ? 18 18 unit v v a na ma v ? pf khz s s symbol v f v fm i r i ceo i c v ce (sat) r iso f c t r t f c f response time rise time fall time i f = 20ma i fm = 0.5a v r = 4v terminal capacitance ? 30 250 pf c t v = 0, f = 1khz v ce = 50v, i f = 0 i f = 5ma, v ce = 5v i f = 20ma, i c = 1ma v = 0, f = 1mhz v ce = 2v, i c = 2ma, r l = 100 ? v ce = 5v, i c = 2ma, r l = 100 ? , ? 3db dc500v, 40 to 60%rh (t a = 25?c) collector-emitter breakdown voltage 80 ?? v bv ceo i c = 0.1ma, i f = 0 emitter-collector breakdown voltage 6 ?? v bv eco i e = 10 a, i f = 0 input output absolute maximum ratings (t a = 25?c) parameter symbol unit input forward current ma *1 peak forward current a power dissipation mw output collector-emitter voltage v emitter-collector voltage v collector current ma collector power dissipation mw total power dissipation mw *2 isolation voltage operating temperature ?c storage temperature ?c *3 soldering temperature i f i fm p v ceo v eco i c p c p tot v iso (rms) t opr t stg t sol ?c *1 pulse width 100 s, duty ratio : 0.001 *2 40 to 60%rh, ac for 1minute, f=60hz *3 for 10s rating 50 1 reverse voltage v v r 6 70 80 6 50 150 200 ? 30 to + 100 ? 55 to + 125 260 5.0 kv 4 pc817xj0000f series
sheet no.: d2-a03102en model line-up i c [ma] (i f = 5ma, v ce = 5v, t a = 25?c) lead form package rank mark with or without a b c d a or b b or c c or d a, b or c b, c or d a, b, c or d 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 15.0 to 30.0 4.0 to 13.0 6.5 to 20.0 10.0 to 30.0 4.0 to 20.0 6.5 to 30.0 4.0 to 30.0 through-hole pc817xj0000f pc817x1j000f pc817x2j000f PC817X3J000F pc817x4j000f pc817x5j000f pc817x6j000f pc817x7j000f pc817x8j000f pc817x9j000f pc817x0j000f wide through-hole pc817xfj000f pc817xf1j00f pc817xf2j00f pc817xf3j00f pc817xf4j00f pc817xf5j00f pc817xf6j00f pc817xf7j00f pc817xf8j00f pc817xf9j00f pc817xf0j00f sleeve 100pcs/sleeve model no. i c [ma] (i f = 5ma, v ce = 5v, t a = 25?c) lead form package rank mark with or without a b c d a or b b or c c or d a, b or c b, c or d a, b, c or d 2.5 to 30.0 4.0 to 8.0 6.5 to 13.0 10.0 to 20.0 15.0 to 30.0 4.0 to 13.0 6.5 to 20.0 10.0 to 30.0 4.0 to 20.0 6.5 to 30.0 4.0 to 30.0 pc817xij000f pc817xi1j00f pc817xi2j00f pc817xi3j00f pc817xi4j00f pc817xi5j00f pc817xi6j00f pc817xi7j00f pc817xi8j00f pc817xi9j00f pc817xi0j00f taping pc817xpj000f pc817xp1j00f pc817xp2j00f pc817xp3j00f pc817xp4j00f pc817xp5j00f pc817xp6j00f pc817xp7j00f pc817xp8j00f pc817xp9j00f pc817xp0j00f wide smt gullwing pc817xfpj00f ? ? ? ? ? ? ? ? ? ? 2 000pcs/reel sleeve 100pcs/sleeve smt gullwing model no. 5 please contact a local sharp sales representative to inquire about production status. pc817xj0000f series
sheet no.: d2-a03102en 100 10 1 0.1 current transfer ratio ctr (%) 200 400 0 100 300 500 forward current i f (ma) v ce = 5v t a = 25?c fig.6 current transfer ratio vs. forward current duty ratio pulse width 100 s t a = 25?c 10 100 10 ? 3 10 ? 2 10 ? 1 peak forward current i fm (ma) 1 10 000 1 000 fig.5 peak forward current vs. duty ratio 6 pc817xj0000f series forward current i f (ma) ambient temperature t a (?c) 0 50 40 30 20 10 ? 30 0 25 50 55 75 100 125 fig.1 forward current vs. ambient temperature diode power dissipation p (mw) ambient temperature t a (?c) 0 100 80 70 60 40 20 ? 30 0 25 50 55 75 100 125 fig.2 diode power dissipation vs. ambient temperature collector power dissipation p c (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125 fig.3 collector power dissipation vs. ambient temperature fig.4 total power dissipation vs. ambient temperature total power dissipation p tot (mw) ambient temperature t a (?c) 0 250 200 150 100 50 ? 30 0 25 50 75 100 125
sheet no.: d2-a03102en collector-emitter saturation voltage v ce (sat) (v) forward current i f (ma) 0 0 1 2 3 4 5 510 6 15 7ma 1ma 3ma 5ma i c = 0.5ma t a = 25?c fig.12 collector-emitter saturation voltage vs. forward current 80 60 40 20 0 ? 30 100 10 ? 5 10 ? 6 10 ? 7 10 ? 8 10 ? 9 10 ? 10 10 ? 11 collector dark current i ceo (a) ambient temperature t a (?c) v ce = 50v fig.11 collector dark current vs. ambient temperature relative current transfer ratio ( % ) 0 150 100 50 ? 40 0 ? 20 20 40 60 80 100 ambient temperature t a (?c) i f = 1ma, v ce = 5v i f = 5ma, v ce = 5v fig.9 relative current transfer ratio vs. ambient temperature 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 collector-emitter saturation voltage v ce (sat) (v) i f = 20ma i c = 1ma ambient temperature t a (?c) ? 40 0 ? 20 20 40 60 80 100 fig.10 collector - emitter saturation voltage vs. ambient temperature 7 pc817xj0000f series 50?c 25?c 0?c 0 2 0.5 1 1.5 2 2.5 3 3.5 5 10 20 50 100 1 ? 25?c t a = 75?c forward current i f (ma) forward voltage v f (v) fig.7 forward current vs. forward voltage 0 0 5 1 10 15 20 25 30 23456789 20ma 10ma 5ma collector current i c (ma) collector-emitter voltage v ce (v) i f =30ma p c (max.) t a =25?c fig.8 collector current vs. collector-emitter voltage
sheet no.: d2-a03102en frequency f (khz) ? 20 0 1 ? 10 100 10 1k ? 100 ? voltage gain a v (db) r l = 10k ? v ce = 5v i c = 2ma t a = 25?c fig.15 frequency response v cc r l output please refer to the conditions in fig.15. r d v ce fig.16 test circuit for frequency response remarks : please be aware that all data in the graph are just for reference and not for guarantee. 8 pc817xj0000f series v cc t f t r t s 90% 10% t d output input r l input output r d please refer to the conditions in fig.13. v ce fig.14 test circuit for response time fig.13 response time vs. load resistance 0.01 0.1 1 10 10 0.1 1 100 response time ( s) v ce = 2v i c = 2ma t a = 25?c t s t d t f t r load resistance r l (k ? )
sheet no.: d2-a03102en design considerations while operating at i f <1.0ma, ctr variation may increase. please make design considering this fact. this product is not designed against irradiation and incorporates non-coherent ired. degradation in general, the emission of the ired used in photocouplers will degrade over time. in the case of long term operation, please take the general ired degradation (50% degradation over 5 years) into the design consideration. recommended foot print (reference) ? for additional design assistance, please review our corresponding optoelectronic application notes. 9 smt gullwing lead-form wide smt gullwing lead-form 10.2 2.54 1.7 2.2 8.2 2.54 1.7 2.2 (unit : mm) design guide pc817xj0000f series
sheet no.: d2-a03102en manufacturing guidelines reflow soldering: reflow soldering should follow the temperature profile shown below. soldering should not exceed the curve of temperature profile and time. please don't solder more than twice. soldering method flow soldering : due to sharp's double transfer mold construction submersion in flow solder bath is allowed under the below listed guidelines. flow soldering should be completed below 270?c and within 10s. preheating is within the bounds of 100 to 150?c and 30 to 80s. please don't solder more than twice. hand soldering hand soldering should be completed within 3s when the point of solder iron is below 400?c. please don't solder more than twice. other notices please test the soldering method in actual condition and make sure the soldering works fine, since the impact on the junction between the device and pcb varies depending on the tooling and soldering conditions. 10 1234 300 200 100 0 0 (?c) terminal : 260?c peak ( package surface : 250?c peak) preheat 150 to 180?c, 120s or less reflow 220?c or more, 60s or less (min) pc817xj0000f series
sheet no.: d2-a03102en solvent cleaning: solvent temperature should be 45?c or below immersion time should be 3 minutes or less ultrasonic cleaning: the impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of pcb and mounting method of the device. therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. recommended solvent materials: ethyl alcohol, methyl alcohol and isopropyl alcohol in case the other type of solvent materials are intended to be used, please make sure they work fine in ac- tual using conditions since some materials may erode the packaging resin. cleaning instructions this product shall not contain the following materials. and they are not used in the production process for this product. regulation substances : cfcs, halon, carbon tetrachloride, 1.1.1-trichloroethane (methylchloroform) specific brominated flame retardants such as the pbbos and pbbs are not used in this product at all. this product shall not contain the following materials banned in the rohs directive (2002/95/ec). ?ead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (pbb), polybrominated di- phenyl ethers (pbde). presence of odc 11 pc817xj0000f series
sheet no.: d2-a03102en package specification 12 12.0 6.7 5.8 10.8 15.0 6.35 5.9 10.8 520 2 520 2 sleeve package 1. through-hole or smt gullwing lead-form package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions (unit : mm) (unit : mm) 2. wide through-hole lead-form or wide smt gullwing lead-form package materials sleeve : hips (with anti-static material) stopper : styrene-elastomer package method max. 100pcs of products shall be packaged in a sleeve. both ends shall be closed by tabbed and tabless stoppers. the product shall be arranged in the sleeve with its anode mark on the tabless stopper side. max. 20 sleeves in one case. sleeve outline dimensions pc817xj0000f series
sheet no.: d2-a03102en 13 tape and reel package 1. smt gullwing package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions f k e i d j g b h h a c 5? max. dimensions list (unit : mm) a 16.0 0.3 b 7.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 10.4 0.1 i 0.4 0.05 j 4.2 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 a c e g f b d dimensions list (unit : mm) a 330 b 17.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc817xj0000f series
sheet no.: d2-a03102en 2. wide smt gullwing package materials carrier tape : ps cover tape : pet (three layer system) reel : ps carrier tape structure and dimensions 14 dimensions list a 24.0 0.3 b 11.5 0.1 c 1.75 0.1 d 8.0 0.1 e 2.0 0.1 h 12.4 0.1 i 0.4 0.05 j 4.1 0.1 k 5.1 0.1 f 4.0 0.1 g 1.5 + 0.1 ? 0 (unit : mm) j g i e c b a h h 5? max. f d k a c e g f b d dimensions list (unit : mm) a 330 b 25.5 1.5 c 100 1.0 d 13 0.5 e 23 1.0 f 2.0 0.5 g 2.0 0.5 pull-out direction [packing : 2 000pcs/reel] reel structure and dimensions direction of product insertion pc817xj0000f series
?the circuit application examples in this publication are provided to explain representative applications of sharp devices and are not intended to guarantee any circuit design or license any intellectual property rights. sharp takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of sharp's devices. ?contact sharp in order to obtain the latest device specification sheets before using any sharp device. sharp reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. manufacturing locations are also subject to change without notice. ?observe the following points when using any devices in this publication. sharp takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specified in the relevant specification sheet nor meet the following conditions: (i) the devices in this publication are designed for use in general electronic equipment designs such as: --- personal computers --- office automation equipment --- telecommunication equipment [terminal] --- test and measurement equipment --- industrial control --- audio visual equipment --- consumer electronics (ii) measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when sharp devices are used for or in connection with equipment that requires higher reliability such as: - -- transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- traffic signals --- gas leakage sensor breakers --- alarm equipment --- various safety devices, etc. (iii) sharp devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- space applications --- telecommunication equipment [trunk lines] --- nuclear power control equipment - -- medical and other life support equipment (e.g., scuba). ?if the sharp devices listed in this publication fall within the scope of strategic products described in the foreign exchange and foreign trade law of japan, it is necessary to obtain approval to export such sharp devices. ?this publication is the proprietary product of sharp and is copyrighted, with all rights reserved. under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of sharp. express written permission is also required before any use of this publication may be made by a third party. ?contact and consult with a sharp representative if there are any questions about the contents of this publication. 15 sheet no.: d2-a03102en important notices pc817xj0000f series [e178]

▲Up To Search▲

Price & Availability of PC817X3J000F

	To Download PC817X3J000F Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .